Product Description
Nano copper foil tape is a high-performance conductive adhesive tape designed for EMI/RFI shielding, grounding, thermal management, and electrical repair applications. It features a pure copper foil backing with a nano-engineered surface treatment, offering excellent electrical and thermal conductivity combined with strong adhesion and durability
Technical Specifications
| Property | Value |
|---|---|
| Backing Material | Pure Copper Foil (≥99.90% Cu) with Nano Coating |
| Adhesive Type | Conductive Acrylic |
| Total Thickness | 0.015 mm – 0.1 mm (15 μm – 100 μm) |
| Width Options | 5 mm – 100 mm (custom widths available) |
| Standard Length | 33 m or 50 m rolls |
| Electrical Resistance | ≤ 0.05 Ω/sq (nano side ≥100 MΩ) |
| Peel Adhesion | ≥600 – ≥1500 gf/in (depending on thickness) |
| Operating Temperature | -10°C to 120°C (short-term up to 180°C) |
| Thermal Conductivity | Copper layer: 380–400 W/m·K; Nano coating: ≥2500 W/m·K |
| Tensile Strength | 65 N/cm |
| Elongation at Break | 6% |
| Flame Retardancy | UL 510 compliant (select grades) |
Applications
| Industry | Application |
|---|---|
| Consumer Electronics | Smartphones, laptops, tablets, LED lighting heat dissipation and EMI shielding |
| PCB & Circuit Repair | Circuit board rework, grounding, static discharge protection |
| EMI/RFI Shielding | Enclosures, cables, electronic device shielding |
| Automotive & Aerospace | Cable wrapping, component shielding |
| Flexible Circuits | Coils, transformers, flexible circuit board connections |
| Industrial Equipment | Heat sink attachment, thermal interface applications |
Customization Options
Thickness: 0.015 mm to 0.1 mm
Width: Custom widths upon request
Adhesive: Acrylic or conductive adhesive options available
Die-cutting: Precision die-cut shapes according to customer drawings
Liner: Siliconized paper release liner included
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