What Is The Function Of Thermal Conductive Materials?

Thermal conductive materials are developed and designed to meet the thermal conductivity requirements of equipment, with excellent performance and reliability. They are suitable for various environments and requirements, and have proper solutions for possible heat dissipation problems. They provide powerful assistance for the high integration of equipment and the design of ultra small and ultra-thin products.
There are extremely fine uneven gaps between the surface of microelectronic materials and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the base area of the heat sink, and the rest are air gaps. Because the thermal conductivity of air is only 0.024W/(m · K), it is a poor conductor of heat, which will result in a very large contact thermal resistance between electronic components and the heat sink, seriously hindering the conduction of heat and ultimately causing low efficiency of the heat sink.
Filling these gaps with high thermal conductivity thermal interface materials, removing air from them, and establishing effective thermal conduction channels between electronic components and heat sinks can significantly reduce contact thermal resistance and fully utilize the function of the heat sink.
The ideal thermal interface material should have the following characteristics:
(1) High thermal conductivity
(2) High flexibility and toughness ensure that the thermal interface material can fully fill the gaps on the contact surface under lower installation pressure conditions, ensuring that the contact thermal resistance between the thermal interface material and the contact surface is very small;
(3) Insulation properties;
(4) Easy to install and detachable;
(5) Widely applicable, it can be used to fill small gaps as well as large gaps.